Vertical Chamber PVD Vacuum Coating Machine Direct Plating Cooper On LED Ceramic Chips

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Product
Vertical Chamber PVD Vacuum Coating Machine Direct Plating Cooper On L...
Posting date : Feb 09, 2018
Membership
Free Member Scince Jan 26, 2018
FOB Price
negotiable
Port
Made in China
Payment Terms
L/C, D/A, D
Package
Export standard, to be packed in new cases/cartons
Keyword :
Category
Contact
ROYAL
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Product Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
ROYAL
Model Number
RTAC1215-SP
HS-CODE
85-
Package & Delivery Lead Time
Package
Export standard, to be packed in new cases/cartons
Delivery Lead Time
12 weeks
Detailed Description
Copper Sputtering Coating Machine Specifications Performance 1. Ultimate Vacuum Pressure: better than 5.010-6 Torr. 2. Operating Vacuum Pressure: 1.010-4 Torr. 3. Pumpingdown Time: from 1 atm to 1.010-4 Torr 3 minutes ( room temperature, dry, clean and empty chamber) 4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc. 5. Operating Model: Full Automatically /Semi-Auto/ Manually Structure The vacuum coating machine contains key completed system listed below: 1. Vacuum Chamber 2. Rouhging Vacuum Pumping System (Backing Pump Package) 3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump) 4. Electrical Control and Operation System 5. Auxiliarry Facility System (Sub System) 6. Deposition System Copper Sputtering Coating Machine Key Features 1. Equipped with 8 steer arc cathodes and DC Sputtering Cathodes, MF Sputtering Cathodes, Ion source unit. 2. Multilayer and co-deposition coating available 3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion. 4. Ceramic/ Al2O3/AlN substrates heating up unit; 5. Substrate rotation and revolution system, for 1-side coating and 2-sides coating. Cooper Magnetron Sputtering Coating Plant on Ceramic Radiating Substrate The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application isCeramic Radiating Substrate. Cooper conductive film deposition on Al2O3, AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing methods:DBC LTCC HTCC, much lower production cost is its high feature. Royal technology team assited our customer to developed the DPC process sucessfully with PVD sputtering technology. The RTAC1215-SP machine designed exclusively for Copper conductive film coating on Ceramic chips, ceramic circuit board. Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

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