Silicone-free thermal putty

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Selling leads
Silicone-free thermal putty
Posting date : Aug 14, 2017
Membership
Free Member Scince Jan 27, 2016
FOB Price
Negotiation
Min. Order Quantity
as amount
Supply Abillity
500000kg
Port
Shenzhen
Payment Terms
T/T in advance
Package
as request
Keyword :
Category
Contact
Lynn Gui
Selling Leads Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
GLPOLY
Model Number
XK-GN30
HS-CODE
-
Package & Delivery Lead Time
Package
as request
Delivery Lead Time
15 days
Detailed Description
Introduction
Syringes packaging, automated production, high temperature, non-corrosive to metal, 100% thermal curing putty.  XK-GN series is a high thermal performance Gel , it based on TPR, Filled with a variety of high-performance ceramic powder. It also has high thermal conductivity, low thermal resistance, good insulation characteristics .
 
Features
Good compressibility
Non-silicone
Non-curing
Resists pump-out
 
Applications
Consumer electronics.
Automotive Systems.
Telecommunications.
 
 
Unit
XK-GN15
XK-GN20
XK-GN30
Method
Color
 
Dark Gray
Gray
light Gray
visual
Flow Rate (30cc EFD cartridges 0.100”orifice 90psi)
g/min
7
5
5
 
Specific Gravity
g/cm3
2.6
2.8
3
ASTM D792
Volume Resistivity
Ωcm
>1013
>1013
>1013
ASTM D257
Thermal Conductivity
W/mK
1.4
2
3
HOT DISK
Breakdown Voltage
KV/mm
10
10
10
ASTM D149
Dielectric Constant
1
6
7
8
ASTM D150
Low limit  BLT Thickness
mm
0.05
0.05
0.08
ASTM D374
Application temperature
 -30~150
 -30~150
 -30~150
 
Shelf life
month
12
12
12
 
Siloxane Volatiles D4~D20
%
0
0
0
GC-FID
Coefficient of Thermal Expansion,
ppm/K
210
205
180
 
Flammability
UL94
V-0
V-0
V-0
UL94
 

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