multilayer pcbs with ENIG/immersion gold surface finish

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multilayer pcbs with ENIG/immersion gold surface finish
Posting date : Jun 18, 2013
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Free Member Scince Jun 17, 2013
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HS-CODE
85-
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Base-Material: FR4 Layer count: 6-layer copper thickness:1oz(0.5oz/1.5oz/2oz/2.5oz/3oz) Board thickness: 1.6mm(0.6mm/0.8mm/1.0mm/1.2mm/2.0mm/2.4mm) solder mask:green(yellow/blue/black/red/white/peelable) Silkscreen:white(black/green/blue/red/white) Surface Finish:ENIG/immersion gold(immersion silver/immersion tin//chemical gold/flash gold /hard gold/OSP/HASL(lead-free) Minimum line width: 0.15mm/(6mil)/(0.006inch) Minimum line spacing: 0.15mm/(6mil)/(0.006inch) Minimum hole size:0.25mm/(10mil)/(0.01inch)

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