Manufacturing TGV Board-level Packaging Glass Substrate Round Optical

High-Rigidity Glass Substrate for Through-Glass Via (TGV) Processes
We supply precision-engineered round optical glass substrates for board-level packaging using TGV (Through-Glass Via) technology. These thick glass wafers are optimized for high-density interconnects in advanced microelectronic and photonic packaging systems, offering excellent mechanical strength, thermal stability, and dimensional control. Available in standard and custom diameters, our substrates support direct via etching, metallization, and wafer-level assembly processes.

Key Features

• Material Options: High-purity borosilicate glass, fused silica, or aluminosilicate glass

• Thickness Range: 0.5 mm to 2.0 mm (customizable up to 5.0 mm)

• Diameter: 2", 4", 6", 8", or custom round formats

• Surface Quality: Optical-grade polish (10/5 to 60/40), rough ground available for pre-processing

• Thermal Expansion: Matched to silicon or specific package requirements

• TGV Processing Compatibility: Optimized for deep via drilling (laser or wet etch), metal filling, and planarization

Custom Processing Services

As a precision glass processor, Lighting offers complete customization to meet your application and integration needs:

• CNC/CO₂/Ultrafast Laser TGV Drilling (hole diameter: ≥20 μm)

• Double-Sided Polishing & Flatness Control (TTV < 10 μm optional)

• Photolithography or Screen Printing Alignment Marks

• Metal Coating: Ti/Cu, Au, ITO, or customer-specified seed layers

• Edge Beveling, Cleaning, and Wafer-Level Packaging Support

Application Scenarios

These TGV-compatible glass substrates are ideal for:

• 5G & RF Packaging – Glass-based interposers for high-frequency signal transmission

• Photonics Integration – Optical I/O, modulators, and silicon photonics alignment

• MEMS Packaging – Hermetic glass covers or interposers with through-glass interconnects

• Biomedical Devices – Glass carrier wafers and sensor packaging platforms

• Power & Logic Devices – Advanced packaging substrates for improved thermal management and signal integrity

Contact us today for TGV substrate design support, prototype sampling, or high-volume production inquiries. Our engineering team ensures precision fabrication, rapid turnaround, and consistent quality control across all packaging glass solutions.