PCB Capability
| Items | Normal standard | Ultimate |
| Material | FR-4;High TG FR-4;CEM-3;CEM-4 | Al-base |
| Layer NO. | 1-20 | 40 |
| Board Size | 50mm*50mm-560mm*640mm | 35mm*50mm |
| Board Thickness | 0.4mm-4.0mm | 0.3mm-6.0mm |
| Thickness Tolerance | ±10% | ±7% |
| Min Hole Size | 0.2mm | 0.15mm |
| Copper Thickness | 18um-105um | 18um-420um |
| Copper Plating hole | 18um-30um | 18um-40um |
| Min Trace Width | 0.1mm | 0.75mm |
| Min Space Width | 0.1mm | 0.75mm |
| SMD Pitch | 0.4mm | 0.4mm |
| BGA Pitch | 0.6mm | 0.6mm |
| Min Annular Ring | 0.07mm | 0.05mm |
| Register Tolerance | 0.05mm | 0.025mm |
| Solder Mask Color | green;blue;black;red | white; yellow |
| Peelable Mask | 0.3mm | 0.5mm |
| HASL Thickness | 2.5um | |
| lead Free HASL | 2.5um | |
| Immersion Gold | Nickel:47um Au:0.05um | Nickel:7um Au:0.2um |
| OSP Thickness | 0.2-2.5um | |
| Outline Tolerance | CNC:±0.1mm; V-CUT:±0.1mm; Punching:±0.15mm | |
| Impedance Control | ±10% | ±7% |
| Warpage | Less than 1% | Less than 0.7% |
| certificate | ISO9001;TS16949 |
| Quantity |
Prototype&Low Volume PCB Assembly,from 1 Board to 250, is specialty,or up to 1000 |
| Type of Assembly | SMT,Thru-hole, DIP |
| Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
| Components | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
| Bare Board Size | Smallest:0.25*0.25 inches Largest:20*20 inches |
| File Formate | Bill of Materials Gerber files Pick-N-Place file |
| Types of Service | Turn-key,partial turn-key or consignment |
| Component packaging | Cut Tape,Tube,Reels,Loose Parts |
| Turn Time | Same day service to 15 days service |
| Testing |
Flying Probe Test,X-ray Inspection AOI Test |