Skype: sales002wisdomshow
Business field
Components type
• BGA on Flex printed circuit.
• PTH connectors, card slots and sockets.
• Metal components housing.
• Micro lead frame.
• PBGA with heat sink.
• Processor plastic sockets.
• Metal Shielding.
• CSP and fine pitches BGA.
• Plastic PLCC.
• Through hole sockets.
• Heavy Mass CCGA & CBGA.
• Underfill or epoxy coated components.
• QFN, VQFN and advanced design QFN.
• Package over package (POP).

2016 new wholesale automatic laser position motherboard chipset repair machine,low cost bga machine
Detail Parameter of WDS-550 low cost bga machine :
|
1 |
Total Power |
4800W |
|
2 |
Upper Heating Power |
800W |
|
3 |
Lower Heating Power |
Second zone:1200W, Third zone: IR 2700W(1200w controlled) |
|
4 |
Power Supply |
(Single Phase) AC 220V±10% 50/60HZ |
|
5 |
Overall Dimension |
L500*W630*H600mm |
|
6 |
Locating Mode |
V-shape card slot+universal fixture+laser position,locate fast |
|
7 |
Temperature Controlling |
K-type thermocouple closed loop control, independent temperature control, precision up to ±2℃ |
|
8 |
Electrical Material |
High sensitive temperature control module+ Delta PLC,+Touch Screen made-in Taiwan+Step driver |
|
9 |
PCB Size |
Max 400*370mm, Min 10*10mm |
|
10 |
Thermocouple Ports |
1 unit |
|
11 |
PCB thickness |
1-5mm |
|
12 |
Applicable chip |
1*1mm-70*70mm |
|
13 |
Weight of machine |
40KG |
Main features of WDS-550 low cost bga machine :
1.Perfect support Soldering, Desoldering, Removing and Mounting the BGA Chip
2.Touch screen and PLC controlling to ensure it work stably and reliably.
3.Components mounting accuracy within 0.01mm , Repair success rate 99%
4.Rework BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc
5.Precise Temperature Control, accuracy within 2℃
6.Three temperature zones to heat up independently.
7.Upper temperature zone can be moved freely, Second zone can be adjusted up and down.
8. Hot air nozzle can be rotated in 360 degree
9.With CE certification, double over temperature protection function




Full Specification of WDS-550 low cost bga machine :
1.Adopts mechatronics design,Z axis adopts step driver,the upper heater can move up and down automatically; the upper heater and placement head are designed 2 in 1,can pick up BGA automatically; with laser position,can locate the chips place fast.easy to use.
2.Equipped with touch panel interface and PLC controlling to ensure it work stably and reliably. And it can storage multiple temperature profiling data of users. With password protection and modification function while power on. The temperature profiles will be displayed on the touch screen.3.Three temperature zones to heat up independently, hot air heat up between up and down zones, IR heat in the bottom, temperature precise control is in±2℃.the up heating head can remove the BGA chips automatically;the second zone can be adjusted up and down. The top and bottom heaters can be set several segments control at the same time. IR heating zone can be adjusted output power in the light of operation requirements.4.The hot air nozzle can be rotated in 360 degree, the IR heater in the bottom can heat up the PCB board uniformly.
5.High accuracy K-type thermocouple closed-loop controlling. It can test temperature accurately through external temperature measurement interface, PCB board positioned by closed V-shape slot. The flexible and convenient universal jigs can prevent any damage or PCB deformation as well as it is suitable for all size of BGA package.6.Large power fan to cool down the PCB quickly. The built-in vacuum pump and external vacuum nozzle is able to take BGA chips out automatically.
7.Having alarm prompt function after welding is done, specially added early warning function for convenient operation.8.It has Passed CE certificate. It is equipped with emergency stop switch and protection equipment to power off automatically when abnormal accident happened. Under this situation that temperature is out of control, circuit can automatically cut off the power with double over temperature protection function.
About us
1.Factory introduce


2.Certificates






What we can also supply:
We are professional BGA rework station manufacturer, commit to provide the one-stop service for customers.
So that we also supply the motherboard repair equipment(like soldering station, desoldering gun, etc) and BGA Reballing tools(like solder ball, flux paste, solder wick, reballing kit, reballing stencils for laptop, ps3,xbox360, mobile, etc)

FAQ
1. How many days can we get the machines ? How many delivery ways can we chose?
The specific time according different shipping ways you chose.
By DHL,Fedex, UPS,etc (Door to Door Service), about 5-7 days to arrive
By Air to your airport (Door to Airport Service ), about 3-5 days to arrive.
By Sea to the seaport, about 30 days to arrive.
2. How about the package ? Is it safe during the delivery ?
All BGA rework machine is packed by standard strong wooden carton with foam inside.
It is can guarantee the safety of shipping.
3. Can you provide the Warranty ? How about the after sales service ?
We have professional after sales team,supply 1 year warranty free for spare parts and whole life technical support.
if meet any question,contact us in any time.
4. This machine is easy to operate? Do you provide the user manual to help me ?
Yes, we will provide the English user manual.The machine is humanized designed, do not worry,it is easy to operate.
5. What is the payment way ?
We accept the payment terms: Bank transfer, Wester Union, Moneygram, Paypal, etc.
Any other questions, Pls send INQUIRY , or CHAT with us, we will try our best to help you.
Att: Vivian
QQ: 2980064125Skype id: sales002wisdomshow
Tel: 0086 075527336219
What's app/ Wechat /Viber /Cell : +86 13714129564
Waiting for you always!