Our Advantages
1. Printed Circuit Boards with Aluminum Core,PCB manufacturing, PCB assembly and PCB design services with 17 years experience
2. ISO9001, TS16949, UL & RoHS
3. Producing capacity 45000 square meters per month
4. Competitive factory direct price with NO MOQ
5. Flying probe test for free
Standard Technique
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Base material |
FR-4/ FR-1/ FR-2/ CEM-1/CEM-3, Aluminum, Metal based |
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Layer count |
2-18 |
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Thickness of finished panel |
0.20mm - 4.0mm |
|
Board Thickness Tolerance |
±10% |
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Inner layer/Outer layer Base Cooper thickness |
0.5 OZ(17 um)/ 0.5 OZ(17 um) |
|
Impedance tolerance |
±10% |
|
Impedance Control |
50Ω |
|
Warp & Twist |
≤0.5% |
|
Peel strength of line |
≥61 B/in (≥107g/mm) |
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Images: |
|
|
Outer layer line width (a) |
0.075mm (3 mil) |
|
Outer layer line space(b) |
0.075mm (3 mil) |
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Image to image tolerance |
±0.075mm (±3 mil) |
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SMD pitch (a) |
0.2 mm(8 mil) |
|
BGA pitch (b) |
0.2 mm (8 mil) |
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Solder Mask: |
|
|
Thickness of solder mask (line end) |
0.4-1.2 mil |
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Thickness of solder mask (line corner) |
≥0.2 mil |
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Hardness of solder mask |
6 H |
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Solder mask registration tolerance |
±2 mil |
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Holes: |
|
|
Min drilling diameter |
0.15 mm |
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Min diameter of finished hole |
0.10 mm |
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Tolerance of PTH diameter |
±2mil (± 50um) |
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Tolerance of NPTH diameter |
±1mil (± 25um) |
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Surface treatment: |
|
|
HASL |
Gold finger |
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Lead free HASL |
Au Panel |
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ENIG |
|
|
OSP |
|
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Outline: |
|
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Max nickel thickness of gold finger |
280u" (7um) |
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Max gold thickness of gold finger |
60u" (1.5um) |
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Certification: |
ISO14001, ISO9001, UL and RoHS |