Material
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LiTaO3 wafers(White or Black &Fe doped)
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Curie Temp
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603±2℃
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Cutting Angle
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X/Y/Z/X112Y/Y36/Y42/Y48/etc
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Diameter/size
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3”/4”/6" LT wafer
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Tol(±)
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<0.20 mm
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Thickness
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0.18 ~ 0.5mm or more
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Primary Flat
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22mm /32mm /42.5mm /57.5mm
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LTV (5mmx5mm)
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<1µm
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TTV
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<3µm
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Bow
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-30
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Warp
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<40µm
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PLTV(<0.5um)
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≥95%(5mm*5mm)
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Orientation Flat
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All available
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Surface Type
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Single Side Polished /Double Sides Polished
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Polished side Ra
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<0.5nm
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Back Side Criteria
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General is 0.2-0.5µm or as customized
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Edge Criteria
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R=0.2mm or Bullnose
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Fe doped
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Fe doped for saw grade LN< wafers
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Wafer Surface Criteria
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Transmissivity
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general:5.9x10-11
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Contamination,
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None
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Particles ¢>0.3 µ m
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<= 30
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Scratch , Chipping
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None
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Defect
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No edge cracks, scratches, saw marks, stains
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Packaging
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Qty/Wafer box
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25pcs per box
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