0.01mm Insulated Iphone Motherboard Jumper Wire Repair BGA Sodering Point

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Home > Product > 0.01mm Insulated Iphone Motherboard Jumper Wire Repair BGA Sodering Point
Selling
0.01mm Insulated Iphone Motherboard Jumper Wire Repair BGA Sodering Point
Posting date : Nov 24, 2017
Membership
Free Member Scince Aug 02, 2017
FOB Price
6.99
Min. Order Quantity
1
Supply Abillity
10000
Port
shanghai
Payment Terms
paypal,western union, moneygram,l/c,D/A
Package
9cmx4cmx1cm
Keyword :
Category
Contact
yonghui
Selling Leads Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
vipprog
Model Number
FX037
HS-CODE
0505-90
Package & Delivery Lead Time
Package
9cmx4cmx1cm
Detailed Description
Superfine 0.01mm Thin Copper insulated Jumper Wire for cell phone PCB Fingerprint Sodering Point Repair, iPhone 7 8 8P X Logic Board PCB Fingerprint Sodering Point connecting line, with Nand protection Cover and ultra-Thin blade for BGA CHIP. 

0.01mm Thin Copper Insulated Jumper Wire: PCB Fingerprint Sodering Point connecting line

Option Package:

Option 1:  3 x jumpers wire + 10 x fingerprint cutting blade Option 2:  3 x jumpers wire + 10 x fingerprint cutting blade+9 x Nand protection Cover

0.01mm Jumper Wire

0.01MM PCB Jumpers Wire is ultra-fine insulated jumper Wire, The kit also include iPhone Nand protection Cover and PCB repair Fingerprint cutting blade imported from Germany, 

The jumper wire kit is compatible with iPhone 8 8P 8X, which  will offer great performance for fingerprint repair and welding disconnection on iPhone CPU BASEBAND components. 

Features:

Jumpers Wire: thinner than 0.02 mm, thinner than the wiring on A10 cover Cutting Knife: Custom imported Germany blade

NAND Protection Cover: help new hand to insert NAND in a safer way for avoiding CPU damage (especially for iphone 6s cover)

Note: add some solder flux / paste between motheboard and cover, which can increase thermal conductivity and reduce CPU heating

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